CADENCE LAUNCHES AURASTACK AI FOR CHIP DESIGN
Cadence has unveiled AuraStack AI Super Agent, an artificial intelligence platform designed to streamline PCB and advanced chip packaging design. Early adopters include Nvidia, TSMC, and Schneider Electric.
Marco Chiappetta / Forbes: Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging…
Jenny Lee / CNBC: Nvidia unveils Cosmos 3 Edge, a world model designed for robots and vision AI agents to perceive and n…
Sakana AI is integrating Nvidia's open-source Nemotron models into its Fugu orchestrator, which dynamically combines mul…
Bloomberg: Japan plans to buy 27,500 Nvidia Rubin chips to develop a domestic AI foundation model for robots, in a Noetr…
Katie Tarasov / CNBC: AMD plans to ship Helios, its first rack-scale AI system to rival Nvidia, later in 2026 to Microso…
Jake Roach / Tom's Hardware: Nvidia details its Vera CPU for data centers, its first CPU with a custom core design, feat…