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CADENCE LAUNCHES AURASTACK AI FOR CHIP DESIGN

Cadence has unveiled AuraStack AI Super Agent, an artificial intelligence platform designed to streamline PCB and advanced chip packaging design. Early adopters include Nvidia, TSMC, and Schneider Electric.

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Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users (Marco Chiappetta/Forbes)

Marco Chiappetta / Forbes: Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging…

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