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SK HYNIX BREAKS GROUND ON $4B INDIANA CHIP FACILITY

SK Hynix held a groundbreaking ceremony for a $4 billion advanced memory packaging facility in Indiana. Mass production of next-generation HBM chips is scheduled to begin in the second half of 2029.

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SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM scheduled to begin in H2 2029 (Bloomberg)

Bloomberg: SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production o…

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